Data Center Interconnect

In today’s network landscape, data centers are one of the fastest growing segments. Networked computer cloud services – accessible from anywhere in the world with an internet connection – are fast becoming the data storage norm for both business and personal applications. This rapid rise of the cloud and the high-speed computing required to support it demands a constant improvement in speed, total capacity, efficiency and cost-per-bit.

While 10Gb/s datalinks were once considered to be the epitome of capability, today almost all new data centers and data center expansions look to the 40Gb/s and 100Gb/s (and soon 200Gb/s and 400Gb/s) formats to keep up with demand.

New formats for data center interconnect, such as the IEEE 100GBASE, are using faster modulation speeds per each fiber, as well as parallel fibers, coarse wavelength division multiplexing (CWDM) and dense wavelength division multiplexing (DWDM) to increase the total traffic each fiber link can carry. To support these new formats, faster photodiodes fabricated in monolithic arrays with precision spacing are needed. Cosemi offers an extensive (and ever-growing) portfolio of photodiode arrays to support the dozens of new standards, including the emerging proprietary super computer mid-board-optics solution using 12x25Gb/s arrays to carry 300Gb/s from point to point.

As serial data rates increase in data centers, the ability of the copper-based cables connecting the vast majority of the racks’ equipment is being exceeded. A 4x25Gb/s 100Gb/s link cannot use traditional copper cables once the length exceeds roughly seven meters. Active optical cables are transforming the data center interconnect landscape. AOCs look and behave just like copper cables, but can extend up to 100 meters (multimode) and are substantially lighter and smaller. Cosemi offers cost-effective 40Gb/s and 100Gb/s AOCs to enable today’s modern data center interconnect.

The increasing number of optical links in data centers means that the pressure is on to reduce costs, power and size. Our ability to deliver in volume combines with our unique business model to allow us to compete with any photodiode vendor in the world. Our Die Level Hermeticity TechnologyTM enables transceiver manufacturers to eliminate expensive hermetic packaging for substantial cost reduction, while maintaining high reliability – even in harsh conditions.

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